Made from high-barrier composite materials, the inner layer is coated with an anti-static coating to effectively block oxygen and moisture, preventing oxidation and static adsorption of the contents. The outer layer is made from high-strength, abrasion-resistant materials with excellent tensile strength, supporting vacuum treatment and meeting the stringent requirements of large-sized industrial packaging.
· Packaging bags for sensor and optoelectronic chips
Sensor chips, optoelectronic chips, touch chips
· Packaging bags for radio frequency communication chips
Rf chips, bluetooth chips, millimeter-wave chips, positioning chips
· Power chip packaging bags
Power management chips, power chips, voltage regulator chips
· Interface driver chip packaging bags
Interface chip, driver chip
· Industrial control terminal chip packaging bags
Automotive chips, iot chips, industrial control chips
· Packaging bags for computing and storage processing chips
Memory chips, operational amplifier chips, video processing chips, digital-to-analog converter chips, signal processing chips
High barrier, moisture-proof, oxidation prevention, moisture barrier, puncture-resistant, tear-resistant.
| Bag-shaped | Three-side seal pouch, three-side seal zipper pouch. |
| Material | Customizable according to your needs, such as: PET/AL/PE, PET/PE, PET/AL/PA/PE, etc. |
| Dimensions | Customizable |
| Thickness | 60 to 200 microns; or according to your requirements. |
| Printing | Adopting 10-color gravure printing technology, using Pantone color guide, CMYK color mode, or according to your design artwork for approval. |
| Packaging Structure Design/Functional Components | Hanging hole, handle, zipper, tear notch, product window, rounded corners |
| Certification | BRC | FSSC22000 | ISO9001 | ISO14001 | ISO45001 | SGS | CNAS | MA |


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